PANGOMICRO Logos PGL22G FPGA SoM Core Board P22

ACPGL22G

  • Model

    P22
  • Email

    David.ding@alinx.com
  • Temperature class

    0°C~70°C


China PANGOMICRO Logos FPGA SoM Core Board

High speed, high bandwidth, and high capacity are suitable for high-speed data communication, video image processing, high-speed data acquisition, and other applications

ACPGL22G-紫光同创-核心板_03.jpg

Key Features

·Core board

ACPGL22G-紫光同创-核心板_07.jpg


Product Parameters


SoM Core Board Parameters

FPGA Chip

PGL22G-6CMBG324

DDR3

256MB DDR3

QSPI FLASH

128Mbit

Speed Class

-6

Working Temperature

Commercial 0°C~70°C

LUT5

17536

LUT4

21043

FF

26304

18Kb DRM

48

APM

30

PLL

6

ADC

1

HMEMC

2

MAX user IO

240


Interface and Function

DDR3

1 x 256MB DDR3, 16bit

QSPI Flash

one 128Mbit, Used for FPGA Configuration File and User Data Storage

Crystal Oscillator

50 Mhz Provide Reference Input Clock for FPGA

JTAG

10 pin 2.54mm standard JTAG port for downloading and debugging FPGA programs

AD Converter

4 high-speed expansion ports, using 4 80-Pin inter board connectors and backplane connections

LED

1 power indicator light, 1 configuration light, 1 user LED light

Expansion port

Two 80PIN Panasonic industrial grade connectors


Power Supply Parameters

Voltage Input

+5V DC, Power Supply via Connector CON1


Package List

FPGA Core Board

1


Structure Size

Size Dimension

55mm x 45mm x 6.4mm

Connector height

3.0mm

Number of Layers

10-Layer Core Board PCB

       


ACPGL22G-紫光同创-核心板_11.jpg


The warranty period of all products sold is 12 months, of which FPGA chips and LCD screens are wearing parts and are not covered by the warranty. All accessories and gifts are not covered under warranty.




Alinx Electronic Limited 沪ICP备13046728号