Xilinx Zynq UltraScale+ MPSoC SOM FPGA Core Board XCZU9EG

XCZU9EG

  • Model

    ACU9EG
  • Email

    David.ding@alinx.com
  • Temperature class

    -40℃~85℃
  • Ean

    6971390279168


Xilinx Zynq UltraScale+ MPSoC FPGA High-end FPGA Board

Quad-core ARM Cortex-A53 and Dual-core Cortex-R5 Real-time Processors

Apply to 5G Wireless Infrastructure, High-Speed Data Exchange and Storage Industrial Control, AI intelligence, Cloud computing 4K Video Transmission Processing, and Aerospace

  • ·ARM CPU

    4x ARM CORTEX-A53 + Dual Core  ARM CORTEX-R5

  • ·Chip CPU

    Mali™-400 MP2 GPU

  • ·6GB DDR4

    PS 4GB DDR4, PL 2GB DDR4

  • ·FLASH storage

    8GB eMMC FLASH, 64MB QSPI FLASH

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key Features

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ACU9-15EGEN2.jpg

Corresponding Development Board

·AXU9EG

AXU9-15EG.jpg


*Learn about the corresponding development board, Click to see details>>


Product Performance

Main Parameters

Core board

ACU9EG

FPGA Chip

XCZU9EG-2FFVB1156I

Chip CPU

4x ARM Cortex-A53, 1.333GHz; 2x Cortex™-R5, 533MHz

Chip GPU

Mali™-400 MP2

RAM

PS DDR4 4GB, 64bit, 2400Mbps
PL DDR4 2GB, 32bit, 2400Mbps

PS-end High Speed Connection

PCIe Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort , 4x Tri-mode Gigabit Ethernet

PS-end General Connection

2x USB 2.0, 2x SD / SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO

PL-end GTH

12.5Gb/s x16

Chip Level

Industrial Grade

Working Temperature

-40°c~85°c

Speed Grades

-2

Logic Cells

600K

CLB Flip-Flops

548K

Look Up Tables (LUTs)

274K

Global Clock

4

DSP Slices

2,520

MAX.DISTRIBU-TED RAM

8.8Mb

BLOCK RAM

32.1Mb

ULTRARAM

-

EMMC FLASH

8GB

QSPI FLASH

64MB

HP I/O

96

HD I/O

66


Interface and Function

QSPI Flash

2 Pieces of 256 Mbit QSPI Flash, Used as FPGA User Data Storage

EMMC Flash

8GB, Used as Large-Capacity Storage System

40-120 Pin Expansion Ports

Panasonic Industrial Grade High-Speed Inter-Board Connectors

Crystal Oscillator

33.333MHz Provide for the PS system
200MHz Provide DDR Reference Clock for the PL Logic


Power Supply Parameters

Voltage Input

Board to Board Connector, +12V DC


Package List

FPGA SoM Board

1

 



Structure Size

Size Dimension

3.15 inch x 2.36 inch

Connector Height

0.12 Inch

Number of Layers

16-Layer Core Board PCB

 



       ACU9EG详情-2.jpg

XILINX VITIS-AI DPU

AI Recognition and Detection, Deep Computational Learning

Intelligent identification and detection, image and video processing, security monitoring, machine vision, fire monitoring, traffic safety, smart construction site, smart hotel, smart agriculture, Internet of things

Vehicle Identification

Infrared Vehicle Recognition

AI-识别检测2-淘宝京东_11.jpg

Pedestrian Recognition

Indoor Person Recognition

Fire Detection

Hard Hat Detection

Concrete Defect Detection

PCB Defect Detection

Super Combination with Mali™-400 MP2 GPU, 64bit DDR4 RAM

Industiral Grade Chip Dual ARM Application Processor

4x ARM Cortex-A53, 1.333GHz; Quad Core Cortex™-R5, 533MHz; PS 4GB DDR4, 64bit, Data rate2400Mbps; PL 2GB DDR4, 32bit, Data rate 2400Mbps

ACU9EG.jpg

Get Started Quickly, Shorten Learning and Development Time

Provide Documents to Study

Provide Schematic, PCB, Size Dimension, Package and Reference Design, that to Accelerate the Development of products with Core Board

ACU9EG详情-3.jpg

The warranty period of all products sold is 12 months, of which FPGA chips and LCD screens are wearing parts and are not covered by the warranty. All accessories and gifts are not covered under warranty.

Alinx Electronic Limited 沪ICP备13046728号